用于高温电子应用的薄膜金刚石器件:氢掺杂结构

Hui-Chang Jin, L. Pang, M. Whitfield, R. Jackman
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引用次数: 1

摘要

早期预测金刚石将是高性能、高功率、可在高温下工作的器件的合适材料,但在掺硼(p型)薄膜材料上制造的二极管和场效应晶体管(fet)的特性并不支持这一预测。本文通过近表面氢的掺入,将商业上可获得的多晶金刚石薄膜转变为p型。肖特基二极管和金属半导体场效应管(mesfet)已经使用这种方法制造,显示出前所未有的性能水平;已研制出整流比>10/sup 6/,漏电流< 1na,在100v下无反向偏置击穿迹象,理想因数为1.1的二极管。简单的MESFET结构能够承受100 V的V/sub DS/值,具有低泄漏和电流掐断特性。这些装置在高达200/spl℃的温度下运行似乎是可行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thin film diamond devices for high temperature electronic applications: hydrogen doped structures
Early predictions that diamond would be a suitable material for high performance, high power that could be operated at high temperatures devices were not supported by the characteristics of diodes and field effect transistors (FETs) fabricated on boron doped (p-type) thin film material. In this paper commercially accessible polycrystalline thin film diamond has been turned p-type by the incorporation of near surface hydrogen. Schottky diodes and metal-semiconductor FETs (MESFETs) have been fabricated using this approach which display unprecedented performance levels; diodes with a rectification ratio >10/sup 6/, leakage currents <1 nA, no indication of reverse bias breakdown at 100 V and an ideality factor of 1.1 have been made. Simple MESFET structures that are capable of withstanding V/sub DS/ values of 100 V with low leakage and current pinch-off characteristics have also been fabricated. The operation of these devices at temperatures up to 200/spl deg/C appears feasible.
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