{"title":"毫米波介质集成电路的生产工程特点","authors":"B. Yemelyanenkow","doi":"10.1109/CRMICO.2003.158940","DOIUrl":null,"url":null,"abstract":"Described in this paper is the process of manufacturing of complex elements of millimeter wave dielectric integrated circuits (DIC) on the base of image dielectric guides. Production engineering errors of DIC elements are studied. The features of DIC manufacturing on the base of image dielectric guides in 80-120 GHz frequency band are defined in the process of experimental investigations.","PeriodicalId":131192,"journal":{"name":"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Production engineering features of millimeter wave dielectric integrated circuits\",\"authors\":\"B. Yemelyanenkow\",\"doi\":\"10.1109/CRMICO.2003.158940\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Described in this paper is the process of manufacturing of complex elements of millimeter wave dielectric integrated circuits (DIC) on the base of image dielectric guides. Production engineering errors of DIC elements are studied. The features of DIC manufacturing on the base of image dielectric guides in 80-120 GHz frequency band are defined in the process of experimental investigations.\",\"PeriodicalId\":131192,\"journal\":{\"name\":\"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CRMICO.2003.158940\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CRMICO.2003.158940","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Production engineering features of millimeter wave dielectric integrated circuits
Described in this paper is the process of manufacturing of complex elements of millimeter wave dielectric integrated circuits (DIC) on the base of image dielectric guides. Production engineering errors of DIC elements are studied. The features of DIC manufacturing on the base of image dielectric guides in 80-120 GHz frequency band are defined in the process of experimental investigations.