用于图形计算的30MHz编译芯片组

S. Noujaim, R. Hartley, H. Cline, R. Jerdonek, S. Ludke
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引用次数: 9

摘要

我们将介绍一种采用硅编译器设计的1.25μm CMOS芯片,其器件密度达到1500个晶体管/mm2。芯片的位片元件串行通信,以实现在30MHz时钟速率下吞吐量为5000万乘法/累加/秒的管道。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
30MHz compiled chip set for graphics computations
A 1.25μm CMOS chip that has attained a device density of 1500 transistors/mm2, using a silicon compiler for design, will be described. The bit-slice elements of the chip communicate serially to implement a pipeline with a throughput of 50 million multiply/accumulates/s at a 30MHz clock rate.
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