CMOS sram开路的I/sub DDQ/测试

V. Champac, J. Castillejos, J. Figueras
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引用次数: 11

摘要

分析了存在开放缺陷时CMOS SRAM存储器的性能。已经发现,破坏性读出取决于预充液的水平。提出了两种测试产生数据保留错误的开放缺陷的技术。在第一种技术中,在工作阶段强制一个初始条件。这样,中间电压就会在记忆阶段出现。因此,静态电流消耗(I/sub DDQ/)增加,故障可以检测到I/sub DDQ/。提出了与顺序访问相结合的控制电源电平的第二种技术。这允许通过I/sub DDQ/测试来检测开放缺陷。分析了这两种方法的成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
I/sub DDQ/ testing of opens in CMOS SRAMs
The behavior of a CMOS SRAM memory in the presence of open defects is analyzed. It has been found that destructive read-out depends on the level of the precharge. Two techniques to test open defects producing data retention faults are proposed. In the first technique an initial condition is forced during the working phase. In this way, intermediate voltages appear during the memorizing phase. Hence, the quiescent current consumption (I/sub DDQ/) increases and the fault can be detected sensing the I/sub DDQ/. A second technique controlling the power supply level in conjunction with sequential access is proposed. This allows detection of open defects by I/sub DDQ/ testing. The cost of both proposed approaches is analyzed.
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