K. Shinohara, Qiang Yu, M. Fujita, H. Ishii, H. Ishikawa
{"title":"基于建模技术的球冲击响应","authors":"K. Shinohara, Qiang Yu, M. Fujita, H. Ishii, H. Ishikawa","doi":"10.1109/EPTC.2009.5416434","DOIUrl":null,"url":null,"abstract":"This paper focuses on the study of the drop-impact reliability of solder joints of integrated circuit components on printed circuit boards. The impact strength and impact toughness of solder alloys are investigated by performing the ball impact test (an experimental approach). For comparison with experimental results, the fracture of a single solder joint specimen is numerically simulated using the finite element method. The fatigue strength of solder joints depends strongly on the structure of the intermetallic compound formed between solder balls and copper pads. The stiffness of all interfaces reduces due to the local stress concentration. This stress concentration occurs because of the formation of the structure between the solder ball and the substrate. The reliability of a product depends on the interface between the solder ball and the substrate.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ball impact response based on modeling techniques\",\"authors\":\"K. Shinohara, Qiang Yu, M. Fujita, H. Ishii, H. Ishikawa\",\"doi\":\"10.1109/EPTC.2009.5416434\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper focuses on the study of the drop-impact reliability of solder joints of integrated circuit components on printed circuit boards. The impact strength and impact toughness of solder alloys are investigated by performing the ball impact test (an experimental approach). For comparison with experimental results, the fracture of a single solder joint specimen is numerically simulated using the finite element method. The fatigue strength of solder joints depends strongly on the structure of the intermetallic compound formed between solder balls and copper pads. The stiffness of all interfaces reduces due to the local stress concentration. This stress concentration occurs because of the formation of the structure between the solder ball and the substrate. The reliability of a product depends on the interface between the solder ball and the substrate.\",\"PeriodicalId\":256843,\"journal\":{\"name\":\"2009 11th Electronics Packaging Technology Conference\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 11th Electronics Packaging Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2009.5416434\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 11th Electronics Packaging Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2009.5416434","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper focuses on the study of the drop-impact reliability of solder joints of integrated circuit components on printed circuit boards. The impact strength and impact toughness of solder alloys are investigated by performing the ball impact test (an experimental approach). For comparison with experimental results, the fracture of a single solder joint specimen is numerically simulated using the finite element method. The fatigue strength of solder joints depends strongly on the structure of the intermetallic compound formed between solder balls and copper pads. The stiffness of all interfaces reduces due to the local stress concentration. This stress concentration occurs because of the formation of the structure between the solder ball and the substrate. The reliability of a product depends on the interface between the solder ball and the substrate.
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