{"title":"多层次电迁移诱导挤压技术","authors":"J. Lloyd","doi":"10.1109/IRPS.1983.361985","DOIUrl":null,"url":null,"abstract":"It has been found that wearout failure in multilevel technologies is primarily by electromigration- induced extrusions leading to intralevel short circuits rather than by the traditionally studied open-circuit mode. Recent results are reported, with a discussion of the serious implication that this newly considered failure mode generates.","PeriodicalId":334813,"journal":{"name":"21st International Reliability Physics Symposium","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1983-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Electromigration-Induced Extrusions in Multi-Level Technologies\",\"authors\":\"J. Lloyd\",\"doi\":\"10.1109/IRPS.1983.361985\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been found that wearout failure in multilevel technologies is primarily by electromigration- induced extrusions leading to intralevel short circuits rather than by the traditionally studied open-circuit mode. Recent results are reported, with a discussion of the serious implication that this newly considered failure mode generates.\",\"PeriodicalId\":334813,\"journal\":{\"name\":\"21st International Reliability Physics Symposium\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1983-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"21st International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1983.361985\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"21st International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1983.361985","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electromigration-Induced Extrusions in Multi-Level Technologies
It has been found that wearout failure in multilevel technologies is primarily by electromigration- induced extrusions leading to intralevel short circuits rather than by the traditionally studied open-circuit mode. Recent results are reported, with a discussion of the serious implication that this newly considered failure mode generates.
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