在多核系统中使用60 GHz天线的无线射频数据通信

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI:10.1109/EPEPS.2011.6100178

Ho-Hsin Yeh, N. Hiramatsu, K. Melde

{"title":"在多核系统中使用60 GHz天线的无线射频数据通信","authors":"Ho-Hsin Yeh, N. Hiramatsu, K. Melde","doi":"10.1109/EPEPS.2011.6100178","DOIUrl":null,"url":null,"abstract":"Free space wireless transmission via the 60 GHz antenna in the Multi-Chip Multi-Core (MCMC) architecture is proposed in this paper. Antenna in package (AiP) solution is chosen as the 60GHz antenna configuration and the antenna is designed based on low temperature co-fired ceramic (LTCC) superstrate that could connect to the silicon circuitry via the flip-chip technology. The designed antenna having ground shielded structures and the artificial magnetic conductor (AMC) will demonstrate the azimuth plane signal transmission with the high radiation efficiency.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Wireless RF data communications using 60 GHz antennas in Multi-Core systems\",\"authors\":\"Ho-Hsin Yeh, N. Hiramatsu, K. Melde\",\"doi\":\"10.1109/EPEPS.2011.6100178\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Free space wireless transmission via the 60 GHz antenna in the Multi-Chip Multi-Core (MCMC) architecture is proposed in this paper. Antenna in package (AiP) solution is chosen as the 60GHz antenna configuration and the antenna is designed based on low temperature co-fired ceramic (LTCC) superstrate that could connect to the silicon circuitry via the flip-chip technology. The designed antenna having ground shielded structures and the artificial magnetic conductor (AMC) will demonstrate the azimuth plane signal transmission with the high radiation efficiency.\",\"PeriodicalId\":313560,\"journal\":{\"name\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2011.6100178\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100178","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

摘要

提出了一种基于多芯片多核(MCMC)架构的60ghz天线自由空间无线传输方案。60GHz天线配置采用封装天线(Antenna in package, AiP)方案，采用低温共烧陶瓷(LTCC)衬底设计，可通过倒装芯片技术与硅电路连接。所设计的天线具有接地屏蔽结构和人工磁导体(AMC)，能够以较高的辐射效率传输方位面信号。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wireless RF data communications using 60 GHz antennas in Multi-Core systems

Free space wireless transmission via the 60 GHz antenna in the Multi-Chip Multi-Core (MCMC) architecture is proposed in this paper. Antenna in package (AiP) solution is chosen as the 60GHz antenna configuration and the antenna is designed based on low temperature co-fired ceramic (LTCC) superstrate that could connect to the silicon circuitry via the flip-chip technology. The designed antenna having ground shielded structures and the artificial magnetic conductor (AMC) will demonstrate the azimuth plane signal transmission with the high radiation efficiency.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

自引率

0.00%

发文量