通过自动远程操作安全关闭工艺设备-石本国明

2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) Pub Date : 2017-09-01 DOI:10.23919/ISSM.2017.8089105

Takeshi Watanabe, Hidenori Tanaka, M. Arinaga, Yasunori Fuchikami

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引用次数: 0

摘要

日本半导体公司(JSC)主要在位于日本岩手和大分的两个工厂生产8英寸产品晶圆(图1)。目前，这两个操作共享80%或更多的进程(图2)。此外，我们正在推进设施和生产设备的改进，以实现“PGA 500Gal”。* PGA:峰值地面加速度。

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Safety shutdown of process equipment by automatic remote operation — Kuniaki Ishimoto

Japan Semiconductor Corporation (JSC) has been mainly manufacturing 8inch product wafers at 2 facilities, located at Iwate and Oita in Japan (Figure1). At present, both operations are sharing 80% or more of the processes(Figure2). Furthermore, we are advancing the improvement of both facility and production equipment in order to achieve “PGA 500Gal”. ∗PGA : peak ground acceleration.

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2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM)

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