{"title":"半导体三维集成:加工、材料和应用","authors":"K. Kondo, M. Kada, Kenji Takahashi","doi":"10.1007/978-3-319-18675-7","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":197693,"journal":{"name":"Three-Dimensional Integration of Semiconductors","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications\",\"authors\":\"K. Kondo, M. Kada, Kenji Takahashi\",\"doi\":\"10.1007/978-3-319-18675-7\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":197693,\"journal\":{\"name\":\"Three-Dimensional Integration of Semiconductors\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Three-Dimensional Integration of Semiconductors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/978-3-319-18675-7\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Three-Dimensional Integration of Semiconductors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-319-18675-7","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}