{"title":"低温纯铟接头中金属间化合物的形成与演化","authors":"X. Cheng, C. Liu, V. Silberschmidt","doi":"10.1109/EPTC.2009.5416484","DOIUrl":null,"url":null,"abstract":"Intermetallic compounds (IMCs) properties play a significant role in determining the reliability of solder joints in service. IMCs and their evolution become more important for devices with micro- or nano-scale joints used in cryogenic applications. In this study, the interfacial reactions of In/Cu and In/Ni/Cu due to low-temperature cycling are investigated. The results illustrate that the character of IMCs is linked to thickness of indium joints exposed to low-temperature cycling. The formation of Cu-In IMCs and Ni-In IMCs are diffusion-controlled, and low-temperature cycling results in brittle IMCs.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Intermetallics formation and evolution in pure indium joint for cryogenic application\",\"authors\":\"X. Cheng, C. Liu, V. Silberschmidt\",\"doi\":\"10.1109/EPTC.2009.5416484\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Intermetallic compounds (IMCs) properties play a significant role in determining the reliability of solder joints in service. IMCs and their evolution become more important for devices with micro- or nano-scale joints used in cryogenic applications. In this study, the interfacial reactions of In/Cu and In/Ni/Cu due to low-temperature cycling are investigated. The results illustrate that the character of IMCs is linked to thickness of indium joints exposed to low-temperature cycling. The formation of Cu-In IMCs and Ni-In IMCs are diffusion-controlled, and low-temperature cycling results in brittle IMCs.\",\"PeriodicalId\":256843,\"journal\":{\"name\":\"2009 11th Electronics Packaging Technology Conference\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 11th Electronics Packaging Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2009.5416484\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 11th Electronics Packaging Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2009.5416484","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Intermetallics formation and evolution in pure indium joint for cryogenic application
Intermetallic compounds (IMCs) properties play a significant role in determining the reliability of solder joints in service. IMCs and their evolution become more important for devices with micro- or nano-scale joints used in cryogenic applications. In this study, the interfacial reactions of In/Cu and In/Ni/Cu due to low-temperature cycling are investigated. The results illustrate that the character of IMCs is linked to thickness of indium joints exposed to low-temperature cycling. The formation of Cu-In IMCs and Ni-In IMCs are diffusion-controlled, and low-temperature cycling results in brittle IMCs.
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