{"title":"保形介质结构的多极加速三维电容提取算法","authors":"K. Nabors, Jacob K. White","doi":"10.1109/DAC.1992.227794","DOIUrl":null,"url":null,"abstract":"The new three-dimensional capacitance calculation program FASTCAP2 is described. Like the earlier program FASTCAP, FASTCAP2 is based on a multipole-accelerated algorithm that is efficient enough to allow three-dimensional capacitance calculations to be part of an iterative design process. FASTCAP2 differs from FASTCAP in that it was able to analyze problems with multiple-dielectrics, thus extending the applicability of the multiple-accelerated approach to a wider class of integrated circuit interconnect and packaging problems.<<ETX>>","PeriodicalId":162648,"journal":{"name":"[1992] Proceedings 29th ACM/IEEE Design Automation Conference","volume":"236 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":"{\"title\":\"Multipole-accelerated 3-D capacitance extraction algorithms for structures with conformal dielectrics\",\"authors\":\"K. Nabors, Jacob K. White\",\"doi\":\"10.1109/DAC.1992.227794\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The new three-dimensional capacitance calculation program FASTCAP2 is described. Like the earlier program FASTCAP, FASTCAP2 is based on a multipole-accelerated algorithm that is efficient enough to allow three-dimensional capacitance calculations to be part of an iterative design process. FASTCAP2 differs from FASTCAP in that it was able to analyze problems with multiple-dielectrics, thus extending the applicability of the multiple-accelerated approach to a wider class of integrated circuit interconnect and packaging problems.<<ETX>>\",\"PeriodicalId\":162648,\"journal\":{\"name\":\"[1992] Proceedings 29th ACM/IEEE Design Automation Conference\",\"volume\":\"236 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"19\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1992] Proceedings 29th ACM/IEEE Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DAC.1992.227794\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1992] Proceedings 29th ACM/IEEE Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DAC.1992.227794","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multipole-accelerated 3-D capacitance extraction algorithms for structures with conformal dielectrics
The new three-dimensional capacitance calculation program FASTCAP2 is described. Like the earlier program FASTCAP, FASTCAP2 is based on a multipole-accelerated algorithm that is efficient enough to allow three-dimensional capacitance calculations to be part of an iterative design process. FASTCAP2 differs from FASTCAP in that it was able to analyze problems with multiple-dielectrics, thus extending the applicability of the multiple-accelerated approach to a wider class of integrated circuit interconnect and packaging problems.<>