基于I/sub / DDQ/的逻辑LSI制造过程缺陷模式分类

M. Sanada, K. Uehira, E. Fuse
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引用次数: 1

摘要

异常的I/sub DDQ/(静态V/sub DD/电源电流)表明电路中存在物理损坏,利用这种现象,开发了一种基于cad的故障诊断技术来分析逻辑大规模集成电路的制造成品率。该方法用于在晶圆检测设备识别的几种异常中检测致命缺陷碎片,包括分离各种泄漏故障和确定围绕异常部分的诊断区域的方法。该诊断方法通过逻辑仿真提取诊断区域的逻辑状态,定位与异常I/sub DDQ/相关的测试向量,逐步缩小故障区域。基本的诊断方法是各电路的比较运算。对得到的结果进行了研究,分析了对良率影响最大的制造工艺,并对故障模式进行了分类。这些缺陷信息反馈到逻辑LSI制造工艺,有助于提高制造良率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Defect mode classification in logic LSI manufacturing process using I/sub DDQ/
Abnormal I/sub DDQ/ (Quiescent V/sub DD/ supply current) indicates the existence of physical damage in a circuit Using this phenomenon, a CAD-based fault diagnosis technology has been developed to analyze the manufacturing yield of logic LSI. This method to detect the fatal defect fragments in several abnormalities identified with wafer inspection apparatus includes a way to separate various leakage faults and to define the diagnosis area encircling the abnormal portions. The diagnosis way progressively narrows the faulty area by using logic simulation to extract the logic states of the diagnosis area, and by locating test vectors related to abnormal I/sub DDQ/. The fundamental diagnosis way employs the comparative operation of each circuit. The obtained result is investigated to analyze the manufacturing process which mostly influences yield and to classify the fault mode. These defect information is fed back to logic LSI manufacturing processes, helping to improve manufacturing yield.
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