E. Iwase, H. Onoe, A. Nakai, Kiyoshi Matsumoto, I. Shimoyama
{"title":"柔性基板上多色Led显示屏的温控传输和自布线","authors":"E. Iwase, H. Onoe, A. Nakai, Kiyoshi Matsumoto, I. Shimoyama","doi":"10.1109/MEMSYS.2009.4805347","DOIUrl":null,"url":null,"abstract":"We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 ¿m × 240 ¿m × 75 ¿m) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temparature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Temperature-Controlled Transfer and Self-Wiring for Multi-Color Led Display on a Flexible Substrate\",\"authors\":\"E. Iwase, H. Onoe, A. Nakai, Kiyoshi Matsumoto, I. Shimoyama\",\"doi\":\"10.1109/MEMSYS.2009.4805347\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 ¿m × 240 ¿m × 75 ¿m) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temparature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.\",\"PeriodicalId\":187850,\"journal\":{\"name\":\"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-03-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2009.4805347\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2009.4805347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature-Controlled Transfer and Self-Wiring for Multi-Color Led Display on a Flexible Substrate
We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 ¿m × 240 ¿m × 75 ¿m) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temparature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.