智能电源应用的封装技术

[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs Pub Date : 1991-04-22 DOI:10.1109/ISPSD.1991.146057

C. Neugebauer

{"title":"智能电源应用的封装技术","authors":"C. Neugebauer","doi":"10.1109/ISPSD.1991.146057","DOIUrl":null,"url":null,"abstract":"The author briefly reviews packaging technology for smart power applications. Attention is given to packaging for low to medium voltages and for high voltages; to protective networks; and to smart power hybrids.<<ETX>>","PeriodicalId":127986,"journal":{"name":"[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Packaging technology for smart power applications\",\"authors\":\"C. Neugebauer\",\"doi\":\"10.1109/ISPSD.1991.146057\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author briefly reviews packaging technology for smart power applications. Attention is given to packaging for low to medium voltages and for high voltages; to protective networks; and to smart power hybrids.<<ETX>>\",\"PeriodicalId\":127986,\"journal\":{\"name\":\"[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-04-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1991.146057\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1991.146057","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文简要综述了智能电源应用中的封装技术。注意低压到中压和高压的包装;保护网络;还有智能动力混合动力车。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Packaging technology for smart power applications

The author briefly reviews packaging technology for smart power applications. Attention is given to packaging for low to medium voltages and for high voltages; to protective networks; and to smart power hybrids.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

[1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs

自引率

0.00%

发文量