倒装芯片热偏移失效机制研究

Proceedings GaAs Reliability Workshop, 2003. Pub Date : 1900-01-01 DOI:10.1109/GAASRW.2003.183770

W. Roesch, S. Jittinorasett

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引用次数: 3

摘要

倒装芯片组装提供了一个可靠的，小占地面积，热增强替代线键合。新的铜“凸起”增加了GaAs器件的倒装芯片优势。这项研究将解决新铜凸起的热漂移加速的失效机制。热偏移机制是由温度循环、冲击、装配回流模拟或功率循环加速的机制。[我

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Investigating thermal excursion failure mechanisms for flip chip

Flip Chip assembly offers a reliable, sinall footprint, thermally enhanced alternative to wire bonding. New copper ‘bumps”increase Flip Chip advantages for GaAs devices. This study will address failure mechanisms accelerated by thermal excursions for new copper bumps. Thermal excursion mechanisms are ones accelerated by temperature cycling, thcnnal shock, simulation of assembly reflow or power cycling.[i J

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Proceedings GaAs Reliability Workshop, 2003.

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