Characterization of Electro-chemical Deflash and High Pressure Water Jet through MPCpS

Process window for Electro-chemical Deflash (ED) and High Pressure Water Jet (HPWJ) should be very well defined to ensure complete removal of organic materials on the surface of the frame prior to Metal Finishing (MF). This will help in ensuring complete coverage and good adhesion of metal finish. This will likewise avoid potential package defects like chipping, crack and delamination. In establishing the optimum window for ON Semiconductor Philippines Inc. (OSPI). ED and HPWJ . benchmarking study was performed and results were discussed to the selected Original Engineering Material (OEM) for the design of the machine. The benchmarking activity helped to determine potential failures of the process, the controls needed to monitor the process and the resources to set-up the machine. The resulting design was characterized using the Machine Process Capability Study (MPCpS). This involves five stages such as: 1) Process characterization where each machine and process parts and functions are defined. 2) Metrology characterization where response measuring equipment's precision and accuracy are tested and ensured capable prior to proceeding into the next stage. 3) Machine and Process Capability determination where sets of experiments are performed to determine the capability from the affected process up to the last process step. 4) Optimization if the process is found not capable or Machine and Process cliff if found capable. In this stage, window where the process will fail is determined, and finally 5) Control to ensure that defined capable window is maintained during production. OSPI's well characterized Deflash process has eliminated problems like Missing Lead Finish (MLF) and Resin Bleed (RB). It has also reduced Foreign Material problem by 90% and Tape and Reel final gate problem by 42%. It has helped increase Trim and Form's productivity by 25% by eliminating tin flakes on non-functional areas of the frame. Most of all, since the implementation of this project, there was no observed occurrence of package related problems.