晶圆间混合键合的工艺开发与集成

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Pub Date : 2022-12-07 DOI:10.1109/EPTC56328.2022.10013123

Hongyu Li, H. Ji, G. Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K. Chui

{"title":"晶圆间混合键合的工艺开发与集成","authors":"Hongyu Li, H. Ji, G. Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K. Chui","doi":"10.1109/EPTC56328.2022.10013123","DOIUrl":null,"url":null,"abstract":"Three wet clean processes within conventional BEOL line were evaluated for the hybrid bonding. Global oxide uniformity requirement was found out within hybrid bonding process development. Effects of annealing temperature on the Cu bonding pad and oxide surface were studied. Electrical connection through TSV and hybrid bonding pads was demonstrated.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Process Development and Integration for Wafer-to-Wafer Hybrid Bonding\",\"authors\":\"Hongyu Li, H. Ji, G. Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K. Chui\",\"doi\":\"10.1109/EPTC56328.2022.10013123\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Three wet clean processes within conventional BEOL line were evaluated for the hybrid bonding. Global oxide uniformity requirement was found out within hybrid bonding process development. Effects of annealing temperature on the Cu bonding pad and oxide surface were studied. Electrical connection through TSV and hybrid bonding pads was demonstrated.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013123\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013123","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在常规BEOL生产线上对三种湿清洗工艺进行了评价。在杂化键合工艺开发过程中，发现了整体的氧化物均匀性要求。研究了退火温度对铜键合焊盘和氧化表面的影响。演示了通过TSV和混合键合垫的电气连接。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Process Development and Integration for Wafer-to-Wafer Hybrid Bonding

Three wet clean processes within conventional BEOL line were evaluated for the hybrid bonding. Global oxide uniformity requirement was found out within hybrid bonding process development. Effects of annealing temperature on the Cu bonding pad and oxide surface were studied. Electrical connection through TSV and hybrid bonding pads was demonstrated.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

自引率

0.00%

发文量