爱丽丝ITS升级的原型像素芯片的特性

F. Barile, V. Manzari
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引用次数: 0

摘要

爱丽丝合作正在准备对实验设备进行重大升级,计划在2018-2019年的第二次大型强子对撞机关闭期间安装。ALICE升级的关键是建设新的高分辨率内部跟踪系统(ITS)。它将以50μm厚、像素间距约为30 × 30 μm2的CMOS像素传感器为基础,由7层同心圆探测器组成。进行了全面的实验室和测试光束测量,包括辐照芯片和薄至50 μm芯片的测试。在本文中,我们介绍了在巴里的INFN实验室进行的原型像素芯片表征的最新结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of the prototype pixel chip for the ALICE ITS upgrade
The ALICE Collaboration is preparing a major upgrade of the experimental apparatus, planned for installation in the second long LHC shutdown in the years 2018-2019. The key element of the ALICE upgrade is the construction of the new high resolution Inner Tracking System (ITS). It will be made of seven concentric detector layers based on a 50μm thick CMOS pixel sensor with a pixel pitch of about 30 × 30 μm2. A comprehensive program of lab and test beam measurements is carried out, including tests with irradiated chips and chips thinned to 50 μm. In this paper, we present recent results on the characterization of the prototype pixel chips performed in the INFN laboratory in Bari.
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