基于片上电流传感器和邻域比较逻辑的sram阻性开口缺陷检测技术

F. Lavratti, L. Bolzani, A. Calimera, F. Vargas, E. Macii
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引用次数: 7

摘要

缩放技术使数百万个晶体管集成到一个小区域成为可能。随着存储器密度的增加,在制造过程中产生了新的缺陷类型,这些缺陷已成为纳米尺度静态随机存取存储器(sram)测试的重要问题。存储更多信息的需求迅速增长,导致存储元件占据了系统芯片(SoC)硅面积的很大一部分。在此背景下,提出了一种基于片上电流传感器(OCCS)和邻域比较逻辑(NCL)的sram阻性开放缺陷检测技术。基于硬件的技术背后的主要思想是通过分析邻近SRAM单元的电流来探索评估,以识别制造缺陷的存在。仿真实验结果证明了该方法的有效性。最后,对开销的分析使与当今标准技术的比较成为可能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technique based on On-Chip Current Sensors and Neighbourhood Comparison Logic to detect resistive-open defects in SRAMs
Technology scaling has made possible the integration of millions of transistors into a small area. The consequent increase of memory's density generated new types of defects during the manufacturing process that have become important concerns for the testing of Nano-Scale Static Random Access Memories (SRAMs). The rapidly increasing need to store more information results in the fact that the memory elements occupy great part of the Systemon-Chip's (SoC) silicon area. In this context, a technique based on On-Chip Current Sensors (OCCS) and Neighbourhood Comparison Logic (NCL) to detect resistive-open defects in SRAMs is proposed. The main idea behind the hardware-based technique is to explore the evaluation throughout an analysis of the current of neighbouring SRAM cells in order to identify the presence of manufacturing defects. Experimental results obtained throughout simulations demonstrate the technique's efficiency. Finally, an analysis of the overheads makes possible the comparison with today's standard techniques.
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