{"title":"管理多gbit/s测试挑战","authors":"Ulrich Schoettmer, B. Laquai","doi":"10.1109/TEST.2003.1271150","DOIUrl":null,"url":null,"abstract":"The multi-drop buses transform into an on-board packet switched network connecting high-performance chips with differential high-speed point-to-point links. Serial ATA is leading the pack, PCI-Express is emerging, just to name a few, they will soon be common-place to the PC industry. Chipsets in the computation and consumer space are under severe cost pressure, which creates a severe challenge to the traditional test strategies.","PeriodicalId":236182,"journal":{"name":"International Test Conference, 2003. Proceedings. ITC 2003.","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Managing the multi-gbit/s test challenges\",\"authors\":\"Ulrich Schoettmer, B. Laquai\",\"doi\":\"10.1109/TEST.2003.1271150\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The multi-drop buses transform into an on-board packet switched network connecting high-performance chips with differential high-speed point-to-point links. Serial ATA is leading the pack, PCI-Express is emerging, just to name a few, they will soon be common-place to the PC industry. Chipsets in the computation and consumer space are under severe cost pressure, which creates a severe challenge to the traditional test strategies.\",\"PeriodicalId\":236182,\"journal\":{\"name\":\"International Test Conference, 2003. Proceedings. ITC 2003.\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-09-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Test Conference, 2003. Proceedings. ITC 2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.2003.1271150\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Test Conference, 2003. Proceedings. ITC 2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2003.1271150","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The multi-drop buses transform into an on-board packet switched network connecting high-performance chips with differential high-speed point-to-point links. Serial ATA is leading the pack, PCI-Express is emerging, just to name a few, they will soon be common-place to the PC industry. Chipsets in the computation and consumer space are under severe cost pressure, which creates a severe challenge to the traditional test strategies.