{"title":"考虑各种边界条件的集成全桥器件的通用电热模型","authors":"O. Schepp, M. Lenz","doi":"10.1109/APEC.1997.581452","DOIUrl":null,"url":null,"abstract":"The authors present an analytical electrothermal model of an integrated full-bridge power converter for PSpice. It combines a thermal RC-network including thermal coupling between the DMOS devices with an electrothermal model for each DMOSFET. A comparison between thermal simulation and FEM analysis of an commercially available module is given and, as an application example, the authors show the simulation of switching on a DC motor with the full-bridge device and an approach to include basic printed circuit board characteristics into the simulation.","PeriodicalId":423659,"journal":{"name":"Proceedings of APEC 97 - Applied Power Electronics Conference","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A versatile electrothermal model of an integrated full bridge device taking into account various boundary conditions\",\"authors\":\"O. Schepp, M. Lenz\",\"doi\":\"10.1109/APEC.1997.581452\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors present an analytical electrothermal model of an integrated full-bridge power converter for PSpice. It combines a thermal RC-network including thermal coupling between the DMOS devices with an electrothermal model for each DMOSFET. A comparison between thermal simulation and FEM analysis of an commercially available module is given and, as an application example, the authors show the simulation of switching on a DC motor with the full-bridge device and an approach to include basic printed circuit board characteristics into the simulation.\",\"PeriodicalId\":423659,\"journal\":{\"name\":\"Proceedings of APEC 97 - Applied Power Electronics Conference\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-02-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of APEC 97 - Applied Power Electronics Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC.1997.581452\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of APEC 97 - Applied Power Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.1997.581452","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A versatile electrothermal model of an integrated full bridge device taking into account various boundary conditions
The authors present an analytical electrothermal model of an integrated full-bridge power converter for PSpice. It combines a thermal RC-network including thermal coupling between the DMOS devices with an electrothermal model for each DMOSFET. A comparison between thermal simulation and FEM analysis of an commercially available module is given and, as an application example, the authors show the simulation of switching on a DC motor with the full-bridge device and an approach to include basic printed circuit board characteristics into the simulation.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
