香料模型质量:过程发展观点

P. Bendix
{"title":"香料模型质量:过程发展观点","authors":"P. Bendix","doi":"10.1109/ISQED.2001.915274","DOIUrl":null,"url":null,"abstract":"The author shows what is required of a good model, with emphasis from a process development point of view. The merits of good test chips, physical correctness of the model, and realistic skews (best/worst case) are investigated. Prediction of future technologies with some level of confidence is also looked at. A close working relationship between process integration, model engineering, and circuit design is considered. Advantages of models with well-behaved, smooth, glitchless characteristics and well-behaved derivatives are covered. Parameter correlations, parameter redundancy and model documentation round out the basic model discussions. Extra features are also covered including noise models, high frequency characterization, diode models, parasitic bipolar models, etc. and finally, the need for models to evolve with manufacturing.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Spice model quality: process development viewpoint\",\"authors\":\"P. Bendix\",\"doi\":\"10.1109/ISQED.2001.915274\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author shows what is required of a good model, with emphasis from a process development point of view. The merits of good test chips, physical correctness of the model, and realistic skews (best/worst case) are investigated. Prediction of future technologies with some level of confidence is also looked at. A close working relationship between process integration, model engineering, and circuit design is considered. Advantages of models with well-behaved, smooth, glitchless characteristics and well-behaved derivatives are covered. Parameter correlations, parameter redundancy and model documentation round out the basic model discussions. Extra features are also covered including noise models, high frequency characterization, diode models, parasitic bipolar models, etc. and finally, the need for models to evolve with manufacturing.\",\"PeriodicalId\":110117,\"journal\":{\"name\":\"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-03-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2001.915274\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2001.915274","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

作者从过程开发的角度强调了一个好的模型所需要的东西。研究了良好测试芯片的优点、模型的物理正确性和现实偏差(最佳/最差情况)。对未来技术的预测也有一定程度的信心。在过程集成、模型工程和电路设计之间建立了紧密的工作关系。讨论了具有良好的、光滑的、无故障的特性和良好的导数的模型的优点。参数相关性、参数冗余和模型文档完成了基本的模型讨论。还涵盖了额外的功能,包括噪声模型,高频特性,二极管模型,寄生双极模型等,最后,模型需要随着制造而发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Spice model quality: process development viewpoint
The author shows what is required of a good model, with emphasis from a process development point of view. The merits of good test chips, physical correctness of the model, and realistic skews (best/worst case) are investigated. Prediction of future technologies with some level of confidence is also looked at. A close working relationship between process integration, model engineering, and circuit design is considered. Advantages of models with well-behaved, smooth, glitchless characteristics and well-behaved derivatives are covered. Parameter correlations, parameter redundancy and model documentation round out the basic model discussions. Extra features are also covered including noise models, high frequency characterization, diode models, parasitic bipolar models, etc. and finally, the need for models to evolve with manufacturing.
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