G. van der Plas, C. Soens, G. Vandersteen, P. Wambacq, S. Donnay
{"title":"轻掺杂衬底中衬底噪声传播分析[混合信号集成电路]","authors":"G. van der Plas, C. Soens, G. Vandersteen, P. Wambacq, S. Donnay","doi":"10.1109/ESSDER.2004.1356564","DOIUrl":null,"url":null,"abstract":"Analysis and simulation results of substrate noise in mixed-signal ICs on lightly doped substrates are difficult to bring in agreement with measurements, even for very simple structures. In this paper, substrate noise propagation in lightly doped p-type substrates is studied with a simple test structure. Our study reveals that the current flow is multi-dimensional, and that adjacent layout details (such as nwells and metal wires) influence the propagation between two contacts. The analysis has enabled its to match the measured S/sub 21/ propagation with a simulation model from DC (error<8%) up to 10 GHz with an overall error smaller than 3 dB. Insight in simple structures such as the one considered here, is valuable in improving the understanding of substrate noise in lightly doped substrates.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Analysis of substrate noise propagation in a lightly doped substrate [mixed-signal ICs]\",\"authors\":\"G. van der Plas, C. Soens, G. Vandersteen, P. Wambacq, S. Donnay\",\"doi\":\"10.1109/ESSDER.2004.1356564\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Analysis and simulation results of substrate noise in mixed-signal ICs on lightly doped substrates are difficult to bring in agreement with measurements, even for very simple structures. In this paper, substrate noise propagation in lightly doped p-type substrates is studied with a simple test structure. Our study reveals that the current flow is multi-dimensional, and that adjacent layout details (such as nwells and metal wires) influence the propagation between two contacts. The analysis has enabled its to match the measured S/sub 21/ propagation with a simulation model from DC (error<8%) up to 10 GHz with an overall error smaller than 3 dB. Insight in simple structures such as the one considered here, is valuable in improving the understanding of substrate noise in lightly doped substrates.\",\"PeriodicalId\":287103,\"journal\":{\"name\":\"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDER.2004.1356564\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDER.2004.1356564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of substrate noise propagation in a lightly doped substrate [mixed-signal ICs]
Analysis and simulation results of substrate noise in mixed-signal ICs on lightly doped substrates are difficult to bring in agreement with measurements, even for very simple structures. In this paper, substrate noise propagation in lightly doped p-type substrates is studied with a simple test structure. Our study reveals that the current flow is multi-dimensional, and that adjacent layout details (such as nwells and metal wires) influence the propagation between two contacts. The analysis has enabled its to match the measured S/sub 21/ propagation with a simulation model from DC (error<8%) up to 10 GHz with an overall error smaller than 3 dB. Insight in simple structures such as the one considered here, is valuable in improving the understanding of substrate noise in lightly doped substrates.