一个0.6 tbps, 16端口SRAM设计,具有2级管道和多级传感方案

K. Johguchi, Y. Mukuda, S. Izumi, H. Mattausch, T. Koide
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引用次数: 2

摘要

提出了一种8读8写端口、64-Kbit、32位字长多银行结构的SRAM设计方案。采用两级管道,多级传感方案和2端口SRAM单元,同时实现高速和高稳定性访问。该测试芯片采用90纳米CMOS技术,最大时钟频率为1.2 GHz, si面积为0.91 mm,随机接入带宽为0.6 Tbps, 1.2 GHz时功耗为123 mW。与先前报道的16端口SRAM相比,实现了位面积减少一个数量级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 0.6-Tbps, 16-port SRAM design with 2-stage- pipeline and multi-stage-sensing scheme
A 8-read, 8-write port, 64-Kbit, 32-bit word-length SRAM design with multi-bank architecture is reported. Using a 2-stage-pipeline, a multi-stage-sensing scheme and a 2-port SRAM cell, high speed and high stability access is achieved simultaneously. The fabricated test chip in 90-nm CMOS technology features 1.2 GHz maximum clock frequency, 0.91 mm Si-area, 0.6 Tbps random-access bandwidth, and 123 mW power dissipation at 1.2 GHz. In comparison with a previously reported 16-port SRAM a bit-area reduction by an order of magnitude is achieved.
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