K. Chun, Joonyeop Lee, Ji-hyuk Kim, H. Kim, Kwang-Jun Yoon, Young-il Kim, I. Song
{"title":"用于室内/室外应用的WLAN/WMAN双模收发器系统","authors":"K. Chun, Joonyeop Lee, Ji-hyuk Kim, H. Kim, Kwang-Jun Yoon, Young-il Kim, I. Song","doi":"10.1109/ISWPC.2007.342592","DOIUrl":null,"url":null,"abstract":"WLAN (IEEE 802.11a)/VMAN (IEEE 802.16a) dual mode transceiver chip has been proposed, designed and fabricated. Transceiver RF IC chip with packaged size of 6 mm*6 mm was fabricated using 0.25 um SiGe BiCMOS process. Power amplifier and PLL/VCO chip were fabricated using the same process. Ceramic front-end filter were also fabricated for WLAN/WMAN frequencies. To make compact transceiver system, these chips was mounted on 2 cm*2 cm double side PCB. The full system has been tested with external ADC/DAC and baseband modem. The measured results show that fabricated transceiver system meets the requirements for WLAN/WMAN standards","PeriodicalId":403213,"journal":{"name":"2007 2nd International Symposium on Wireless Pervasive Computing","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A WLAN/WMAN Dual Mode Transceiver System for Indoor/Outdoor Application\",\"authors\":\"K. Chun, Joonyeop Lee, Ji-hyuk Kim, H. Kim, Kwang-Jun Yoon, Young-il Kim, I. Song\",\"doi\":\"10.1109/ISWPC.2007.342592\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"WLAN (IEEE 802.11a)/VMAN (IEEE 802.16a) dual mode transceiver chip has been proposed, designed and fabricated. Transceiver RF IC chip with packaged size of 6 mm*6 mm was fabricated using 0.25 um SiGe BiCMOS process. Power amplifier and PLL/VCO chip were fabricated using the same process. Ceramic front-end filter were also fabricated for WLAN/WMAN frequencies. To make compact transceiver system, these chips was mounted on 2 cm*2 cm double side PCB. The full system has been tested with external ADC/DAC and baseband modem. The measured results show that fabricated transceiver system meets the requirements for WLAN/WMAN standards\",\"PeriodicalId\":403213,\"journal\":{\"name\":\"2007 2nd International Symposium on Wireless Pervasive Computing\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 2nd International Symposium on Wireless Pervasive Computing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISWPC.2007.342592\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 2nd International Symposium on Wireless Pervasive Computing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISWPC.2007.342592","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A WLAN/WMAN Dual Mode Transceiver System for Indoor/Outdoor Application
WLAN (IEEE 802.11a)/VMAN (IEEE 802.16a) dual mode transceiver chip has been proposed, designed and fabricated. Transceiver RF IC chip with packaged size of 6 mm*6 mm was fabricated using 0.25 um SiGe BiCMOS process. Power amplifier and PLL/VCO chip were fabricated using the same process. Ceramic front-end filter were also fabricated for WLAN/WMAN frequencies. To make compact transceiver system, these chips was mounted on 2 cm*2 cm double side PCB. The full system has been tested with external ADC/DAC and baseband modem. The measured results show that fabricated transceiver system meets the requirements for WLAN/WMAN standards
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