{"title":"LIN验证框架:一种新的方法","authors":"A. Sinha, Chetan Anand, S. Gupt","doi":"10.1109/ICVES.2014.7063741","DOIUrl":null,"url":null,"abstract":"Automotive semiconductor industry is passing through an era where it is pushing the complex mechanical interconnects to be replaced by the mechatronical system. To simplify the wiring design and to handle the communication process effectively between various systems in automobiles, LIN (Local Interconnect Network) bus protocol has been designed. It is widely used in numerous applications like door locks, mirrors, rain sensors, powertrain, central ECU, etc even at very high temperature.","PeriodicalId":248904,"journal":{"name":"2014 IEEE International Conference on Vehicular Electronics and Safety","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"LIN validation frame-work: a novel approach\",\"authors\":\"A. Sinha, Chetan Anand, S. Gupt\",\"doi\":\"10.1109/ICVES.2014.7063741\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Automotive semiconductor industry is passing through an era where it is pushing the complex mechanical interconnects to be replaced by the mechatronical system. To simplify the wiring design and to handle the communication process effectively between various systems in automobiles, LIN (Local Interconnect Network) bus protocol has been designed. It is widely used in numerous applications like door locks, mirrors, rain sensors, powertrain, central ECU, etc even at very high temperature.\",\"PeriodicalId\":248904,\"journal\":{\"name\":\"2014 IEEE International Conference on Vehicular Electronics and Safety\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE International Conference on Vehicular Electronics and Safety\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICVES.2014.7063741\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Conference on Vehicular Electronics and Safety","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICVES.2014.7063741","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automotive semiconductor industry is passing through an era where it is pushing the complex mechanical interconnects to be replaced by the mechatronical system. To simplify the wiring design and to handle the communication process effectively between various systems in automobiles, LIN (Local Interconnect Network) bus protocol has been designed. It is widely used in numerous applications like door locks, mirrors, rain sensors, powertrain, central ECU, etc even at very high temperature.