锗锡的氯基和氟基干法蚀刻

Yuan Dong, D. Lei, Xinran Xu, Wei Wang, Y. Yeo
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引用次数: 3

摘要

本文介绍了Cl基和F基干法刻蚀Ge1-xSnx的方法。通过f基干刻蚀可以实现Ge1-xSnx对Ge的高选择性。这是由于在Ge1-xSnx表面形成了一层薄薄的非挥发性SnFx层。在CF4中加入O2可以提高f基干刻蚀的选择性,但会增加Ge1-xSnx样品的表面粗糙度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Chlorine- and Fluorine-based dry etching of Germanium-Tin
Cl- and F- based dry etching of Ge1-xSnx were presented in this work. High selectivity of Ge1-xSnx over Ge can be achieved by F-based dry etching. This is caused by the formation of a thin nonvolatile SnFx layer at Ge1-xSnx surface. Addition of O2 to CF4 can enhance the selectivity of F-based dry etching, but with an increase of surface roughness of Ge1-xSnx samples.
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