K. Drake, M. Abadir, S. Stark, T. Rhyne, M. Eskew, L. Lockwood, K. Salsburg, R. Harr, L. Concha
{"title":"专用电子模块(ASEM) CAD/CAE/CAM接口规范联盟","authors":"K. Drake, M. Abadir, S. Stark, T. Rhyne, M. Eskew, L. Lockwood, K. Salsburg, R. Harr, L. Concha","doi":"10.1109/MCMC.1994.292528","DOIUrl":null,"url":null,"abstract":"This paper introduces a new industry alliance of ASEM merchant foundries, customers, EDA vendors, and suppliers. The objective of this Alliance is to establish an interface specification (guide) and an information model for the bidirectional exchange of electronic design data and information between customers and foundries. The goal of this ARPA funded effort is to reduce the barriers in exchanging design and component data/information between customers and foundries, thus minimizing cost and maximizing efficiency in the design-to-manufacture of ASEMs.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"215 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Application specific electronic modules (ASEM) CAD/CAE/CAM interface specification alliance\",\"authors\":\"K. Drake, M. Abadir, S. Stark, T. Rhyne, M. Eskew, L. Lockwood, K. Salsburg, R. Harr, L. Concha\",\"doi\":\"10.1109/MCMC.1994.292528\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces a new industry alliance of ASEM merchant foundries, customers, EDA vendors, and suppliers. The objective of this Alliance is to establish an interface specification (guide) and an information model for the bidirectional exchange of electronic design data and information between customers and foundries. The goal of this ARPA funded effort is to reduce the barriers in exchanging design and component data/information between customers and foundries, thus minimizing cost and maximizing efficiency in the design-to-manufacture of ASEMs.<<ETX>>\",\"PeriodicalId\":292463,\"journal\":{\"name\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"volume\":\"215 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1994.292528\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292528","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application specific electronic modules (ASEM) CAD/CAE/CAM interface specification alliance
This paper introduces a new industry alliance of ASEM merchant foundries, customers, EDA vendors, and suppliers. The objective of this Alliance is to establish an interface specification (guide) and an information model for the bidirectional exchange of electronic design data and information between customers and foundries. The goal of this ARPA funded effort is to reduce the barriers in exchanging design and component data/information between customers and foundries, thus minimizing cost and maximizing efficiency in the design-to-manufacture of ASEMs.<>
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
