封装中异形电源/地平面的电源完整性和电磁干扰分析方法

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387177

E. Liu, Xingchang Wei, Z. Oo, E. Li

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引用次数: 2

摘要

我们开发了一种二维全波方法，用于高速电子封装中一般电源/地平面的高效功率完整性和EMI分析。二维模拟所得的等效磁源通过自由空间格林函数用于电磁干扰分析。分析和实验验证表明，该方法准确、高效。

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An Efficient Method for Power integrity and EMI Analysis of Irregular-Shaped Power/Ground Planes in Packages

We developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient.

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2007 IEEE Electrical Performance of Electronic Packaging

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