Applying Delphi-like CTM Partitioning on Electrothermally Connected FANTASTIC BCI-ROMs

Coupled analysis is becoming an ever-increasing staple in electronics design, especially the coupling of the electrical and thermal domains. The use of FANTASTIC BCI-ROM to enable accurate and reliable 3D thermal effects to be captured in 1D electrothermal circuits has been demonstrated. The assumption when connecting BCI-ROM components is of uniform 1D heat distribution within the connection, which is rarely the case.The interface between a package and the board it is positioned on, can be highly non-isothermal. To capture this non-uniformity, this paper explores the use of a Delphi-like CTM surface partitioning scheme on connected BCI-ROMs and demonstrates a reduction in the error that is introduced by non-uniform boundaries when comparing the 1D electrothermal circuit to the 3D thermal simulation.