模拟氮化镓finfet中合金簇化限制的低场电子迁移率

V. Kumar, D. Vasileska, M. Povolotskyi
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引用次数: 1

摘要

在过去的几年里,GaN finfet被认为是比传统HEMT器件更低电压应用的有希望的候选者。同时,基于gan的器件可以在与超导和量子计算应用相关的极低温度环境中运行。例如,由于其极化诱导掺杂,GaN可以克服其他技术(如掺杂硅)的载流子冻结挑战。然而,这项技术并非没有问题。随着FinFET尺寸的减小,AlGaN/GaN异质界面上的结构不均匀性(如合金簇化)变得明显。在这项工作中,导出了准一维系统中由于合金聚类引起的散射率,并将其作为一种附加的散射机制添加到内部蒙特卡罗输运核中。我们的模拟结果表明,在较低的温度下,合金簇化对迁移率的限制是显著的。因此,任何GaN finfet的低温分析都必须包括合金簇化的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling Alloy Clustering Limited Low-Field Electron Mobility in GaN FinFETs
In the last few years, GaN FinFETs are being considered as promising candidates for lower voltage applications over conventional HEMT devices. At the same time, GaN-based devices can operate in very low temperature environments that are relevant for superconducting and quantum computing applications. For example, due to its polarization-induced doping, GaN can overcome the carrier freeze-out challenges of other technologies such as doped silicon. This technology is not without problems, however. Structural inhomogeneity at the AlGaN/GaN hetero-interface, such as alloy clustering, becomes significant as the FinFET dimensions decrease. In this work, scattering rate due to alloy clustering is derived for Quasi-1D systems and added as an additional scattering mechanism in the in-house Monte Carlo transport kernel. Our simulation results show that alloy clustering limiting mobility is significant at lower temperatures. Therefore, any cryogenic analysis of GaN FinFETs must include the impact of alloy clustering.
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