零时介质可靠性斜坡法试验

A. Berman
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引用次数: 173

摘要

利用长期建立的时间相关介质击穿(TDDB)特征,证明了样品群体的倾斜电压击穿直方图可以用来准确预测击穿失败率。结果表明,这种直方图可以解释为恒定时间失效的场依赖关系。夯实- tddb关系不涉及拟合参数,只涉及单个与材料相关的参数。该参数对SiO2的温度依赖关系得到了建立。本文认为,通常用于将实验室寿命试验与可靠性失效联系起来的模型本质上是有缺陷的。故障源于温度依赖性和失效时间分布,为了将加速寿命试验外推到使用条件,必须假设这两者。另一方面,实际分布是在斜坡试验中测量的,不需要温度加速度。这一发现对可靠性评估具有深远的意义。电介质寿命试验可以用相对简单和快速的斜坡试验代替,增加了预测的信心。分析表明,对高场筛可靠性的影响是可以绝对定量确定的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Time-Zero Dielectric Reliability Test by a Ramp Method
Using a long-established feature of time dependent dielectric breakdown (TDDB) it is demonstrated that a ramped voltage breakdown histogram of a sample population can be used to accurately forecast the rate of breakdown failures in the field. It is shown that such a histogram can be interpreted as the field dependence of failure at constant time. The tamp-TDDB relationship involves no fitting parameters and only a single material-related parameter. The temperature dependence of this parameter is established for SiO2 Extensive ramp-life test measurements have verified the relationship experimentally. It is argued that the usual models used to relate laboratory life tests to reliability failures are inherently faulty. The faults stem from the temperature dependence and the distributions of failure times, both of which must be assumed in order to extrapolate accelerated life tests to use conditions. On the other hand the actual distribution is measured in a ramp test and the temperature acceleration is not needed. This finding has far-reaching implications for reliability assessment. Dielectric life tests can be replaced by the relatively simple and rapid ramp test with increased confidence in projection. From the analysis it is shown that the effect on reliability of a high field screen can be quantitatively determined in an absolute manner.
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