先进IC基板工艺控制的检测解决方案

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Pub Date : 2022-12-07 DOI:10.1109/EPTC56328.2022.10013168

Jong Eun Park, Misun Hwang, Chan Jin Park, Burhan Ali, Sunki Cho, JungHyun Kim, C. Kim

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引用次数: 0

摘要

在本文中，我们将比较使用各种光学检测技术来发现IC基板在制造过程中的关键缺陷，以提高良率。我们还将介绍一种独特的检测技术，用于检测传统技术难以识别的关键缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Inspection Solutions for Advanced IC Substrate Process Control

In this paper, we will compare the use of various optical inspection technologies to find critical defects in IC substrates during the manufacturing process with the goal of improving yield. We will also introduce a unique inspection technology for the detection of critical defects which are difficult to identify using traditional technologies.

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来源期刊

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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