气相、红外和热气体焊接的比较

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75957

N. Heilmann

{"title":"气相、红外和热气体焊接的比较","authors":"N. Heilmann","doi":"10.1109/EEMTS.1988.75957","DOIUrl":null,"url":null,"abstract":"The three most important reflow methods (vapor-phase, infrared, and hot-gas) are discussed. These methods are compared and the advantages and disadvantages of each are demonstrated. Vapor-phase and infrared are the most frequently used reflow methods. Three main reasons for using vapor-phase reflow are given: heating of printed-circuit boards and components is independent of geometry; heating is independent of package density; and the maximum achievable temperature is limited by the boiling point of the liquid used. Infrared soldering offers certain advantages which are not found in the vapor-phase process. Infrared soldering does not have such an extreme heating rate. The furnaces need much less service and create no problem with the environment.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"83 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A comparison of vapor-phase, infrared and hot-gas soldering\",\"authors\":\"N. Heilmann\",\"doi\":\"10.1109/EEMTS.1988.75957\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The three most important reflow methods (vapor-phase, infrared, and hot-gas) are discussed. These methods are compared and the advantages and disadvantages of each are demonstrated. Vapor-phase and infrared are the most frequently used reflow methods. Three main reasons for using vapor-phase reflow are given: heating of printed-circuit boards and components is independent of geometry; heating is independent of package density; and the maximum achievable temperature is limited by the boiling point of the liquid used. Infrared soldering offers certain advantages which are not found in the vapor-phase process. Infrared soldering does not have such an extreme heating rate. The furnaces need much less service and create no problem with the environment.<<ETX>>\",\"PeriodicalId\":137899,\"journal\":{\"name\":\"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium\",\"volume\":\"83 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EEMTS.1988.75957\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEMTS.1988.75957","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

讨论了三种最重要的回流方法(气相、红外和热气体)。对这些方法进行了比较，并说明了每种方法的优缺点。气相法和红外法是最常用的回流法。给出了使用气相回流的三个主要原因:印刷电路板和元件的加热与几何形状无关;加热与包装密度无关;可达到的最高温度受所用液体沸点的限制。红外焊接具有气相工艺所没有的某些优点。红外焊接没有如此极端的升温速率。这些熔炉需要更少的维护，也不会对环境造成任何问题。

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A comparison of vapor-phase, infrared and hot-gas soldering

The three most important reflow methods (vapor-phase, infrared, and hot-gas) are discussed. These methods are compared and the advantages and disadvantages of each are demonstrated. Vapor-phase and infrared are the most frequently used reflow methods. Three main reasons for using vapor-phase reflow are given: heating of printed-circuit boards and components is independent of geometry; heating is independent of package density; and the maximum achievable temperature is limited by the boiling point of the liquid used. Infrared soldering offers certain advantages which are not found in the vapor-phase process. Infrared soldering does not have such an extreme heating rate. The furnaces need much less service and create no problem with the environment.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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