高性能冷却系统，多通道电渗透流泵，适用于大功率3d - ic

2014 International Conference on Electronics Packaging (ICEP) Pub Date : 2014-06-09 DOI:10.1109/ICEP.2014.6826725

H. Kudo, T. Yonekawa, S. Yoshimi, Y. Oguri, A. Tsukune, Y. Kim, H. Kitada, K. Fjimoto, I. Kinefuchi, Y. Matsumoto, T. Ohba

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引用次数: 2

摘要

针对层叠芯片(3d - ic)的热管理问题，提出了一种多通道电渗透流(EOF)技术应用于闭合通道冷却系统(C3S)。采用MEMS技术制备的EOF泵在Pmax为1 × 104 Pa、Qmax为38 μl/min的条件下提供了流体通过微通道的驱动能力。冷却能力高达140 W/cm2首次被证明。

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High-performance cooling system with multi-channel electro-osmotic flow pumps for high-power 3D-ICs

A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C³S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the P_max of 1 × 10⁴ Pa and Q_max of 38 μl/min. Cooling capability as high as 140 W/cm² was demonstrated for the first time.

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2014 International Conference on Electronics Packaging (ICEP)

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