Takumi Ito, Wang Xueting, Y. Oomuro, Kazutaka Nagashima
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Advanced Process Control Model for Trench Shape of Power Devices
In the semiconductor manufacturing, the manufacturing equipment is managed via the quality control (QC). The shape of the pattern is checked whether it meets the specification. If the shape is out of the specification, some recipe parameters are modified so that the shape meets the specification. The calculation method of the recipe parameters depends on the know-how of the individual engineers, which causes difficulties in the QC. We develop the automatic calculation of the optimal recipe parameters with Advanced Process Control (APC) model in order to solve these problems.
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