预测技术表征,TCAD和紧凑型建模之间的缺失环节

C. McAndrew
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引用次数: 6

摘要

集成电路制造技术中元件的预测建模是耦合技术和电路开发的重要组成部分。TCAD仿真通常被认为是生成预测仿真的最佳方法;然而,它也有一些局限性。在提供预测电路级技术数据时,必须调用工程经验、外推技术要求和紧凑模型。本文描述了有效和高效的技术能力工程预测所需的技术和信息,包括统计变化,并指出了TCAD模拟中的不足(因此是机会),这些模拟是预测技术表征的紧凑建模的基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Predictive technology characterization, missing links between TCAD and compact modeling
Predictive modeling of components in IC manufacturing technologies is an essential part of coupled technology and circuit development. TCAD simulation is often viewed as the best method to generate predictive simulations; however, it has some limitations. Engineering experience, extrapolated technology requirements, and compact models all must be invoked in the provision of predictive circuit level technology data. This paper describes the techniques and information required for effective and efficient engineering predictions of technology capability, including statistical variations, and notes deficiencies (and therefore opportunities) in the TCAD simulations that underlie compact modeling for predictive technology characterization.
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