用于3G无线芯片组的电源管理/模拟基带IC的SoC集成挑战

D. Evans, M. McConnell, P. Kawamura, L. Krug
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引用次数: 16

摘要

以0.35 /spl mu/m的CMOS技术开发了集成电源管理/模拟基带集成电路。该IC具有多个低压差(LDO)线性稳压器、电源开关、DC/DC开关转换器、语音频段编解码器以及WCDMA和GSM基带转换器,所有这些都共享同一衬底。本文探讨了与电源管理和模拟基带片上系统(SoC)集成相关的设计挑战。讨论了最佳平面规划、电源器件隔离、屏蔽、配电、参考生成和降噪策略和技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SoC integration challenges for a power management/analog baseband IC for 3G wireless chipsets
An integrated power management/analog baseband integrated circuit has been developed in 0.35 /spl mu/m CMOS technology. The IC features multiple low-dropout (LDO) linear voltage regulators, power switches, DC/DC switching converters, a voice band CODEC, and WCDMA and GSM baseband converters all sharing the same substrate. This paper examines the design challenges associated with power management and analog baseband system on a chip (SoC) integration. Optimal floorplanning, power device isolation, shielding, power distribution, reference generation, and noise reduction strategies and techniques are discussed.
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