{"title":"采用低频噪声和电阻测量相结合的方法研究了传输线脉冲对互连的影响","authors":"L. W. Chu, W. Chim, K. Pey, A. See","doi":"10.1109/IPFA.2001.941463","DOIUrl":null,"url":null,"abstract":"A novel technique of combining 1/f noise and resistance measurements for characterising electrostatic discharge (ESD) induced voiding damage in aluminium interconnects is reported. The ESD stress was performed using the transmission line pulsing (TLP) technique. Samples of different line widths, with and without an overlying passivation, were studied.","PeriodicalId":297053,"journal":{"name":"Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Effect of transmission line pulsing of interconnects investigated using combined low-frequency noise and resistance measurements\",\"authors\":\"L. W. Chu, W. Chim, K. Pey, A. See\",\"doi\":\"10.1109/IPFA.2001.941463\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel technique of combining 1/f noise and resistance measurements for characterising electrostatic discharge (ESD) induced voiding damage in aluminium interconnects is reported. The ESD stress was performed using the transmission line pulsing (TLP) technique. Samples of different line widths, with and without an overlying passivation, were studied.\",\"PeriodicalId\":297053,\"journal\":{\"name\":\"Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-07-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2001.941463\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2001.941463","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of transmission line pulsing of interconnects investigated using combined low-frequency noise and resistance measurements
A novel technique of combining 1/f noise and resistance measurements for characterising electrostatic discharge (ESD) induced voiding damage in aluminium interconnects is reported. The ESD stress was performed using the transmission line pulsing (TLP) technique. Samples of different line widths, with and without an overlying passivation, were studied.