开发商业MCM基础设施

N.J. Naclerio
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引用次数: 1

摘要

只提供摘要形式。尽管对更高性能、小型化和更具成本效益的子系统封装的需求,MCM技术的潜在用户已经被长交付时间、高成本和依赖未经验证的供应商基础设施的感知风险所挫败。为了解决这些问题,建立了专用电子模块(ASEM)程序。这种效果的目标是帮助建立一个可行的国内供应商基础设施,可以满足军事和商业客户的需要。ASEM概念的模型是商用ASIC业务。周转时间、成本和质量的目标将类似于ASIC供应商今天提供的目标。正在开发的支持技术包括:(1)用于设计、制造和测试的新软件工具;(2)柔性制造设备和工艺;(三)促进亚欧会议产品规格和设计数据电子交换的中介系统和技术。这些技术将被集成到几个原型ASEM铸造厂,以提供经济高效、小批量、快速周转以及大批量生产能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Developing a merchant MCM infrastructure
Summary form only given. Despite demand for higher performance, miniaturization, and more cost-effective subsystem packaging, potential users of MCM technology have been frustrated by long lead times, high costs, and perceived risks of depending upon an unproven supplier infrastructure. In order to address these issues, the application specific electronic module (ASEM) program has been established. The goal of that effect is to help create a viable domestic supplier infrastructure which can serve the needs of both military and commercial customers. The model for the ASEM concept is the merchant ASIC business. Goals for turn-around time, cost, and quality would be similar to what ASIC vendors offer today. Enabling technologies being developed include: (1) new software tools for design, manufacture, and test; (2) flexible manufacturing equipment and processes; and (3) brokering systems and technology to facilitate electronic interchange of ASEM product specifications and design data. These technologies will be integrated at several prototypical ASEM foundries to provide cost-effective, low volume, quick turn-around access as well as high-volume production capability.<>
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