{"title":"开发商业MCM基础设施","authors":"N.J. Naclerio","doi":"10.1109/MCMC.1993.302154","DOIUrl":null,"url":null,"abstract":"Summary form only given. Despite demand for higher performance, miniaturization, and more cost-effective subsystem packaging, potential users of MCM technology have been frustrated by long lead times, high costs, and perceived risks of depending upon an unproven supplier infrastructure. In order to address these issues, the application specific electronic module (ASEM) program has been established. The goal of that effect is to help create a viable domestic supplier infrastructure which can serve the needs of both military and commercial customers. The model for the ASEM concept is the merchant ASIC business. Goals for turn-around time, cost, and quality would be similar to what ASIC vendors offer today. Enabling technologies being developed include: (1) new software tools for design, manufacture, and test; (2) flexible manufacturing equipment and processes; and (3) brokering systems and technology to facilitate electronic interchange of ASEM product specifications and design data. These technologies will be integrated at several prototypical ASEM foundries to provide cost-effective, low volume, quick turn-around access as well as high-volume production capability.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Developing a merchant MCM infrastructure\",\"authors\":\"N.J. Naclerio\",\"doi\":\"10.1109/MCMC.1993.302154\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. Despite demand for higher performance, miniaturization, and more cost-effective subsystem packaging, potential users of MCM technology have been frustrated by long lead times, high costs, and perceived risks of depending upon an unproven supplier infrastructure. In order to address these issues, the application specific electronic module (ASEM) program has been established. The goal of that effect is to help create a viable domestic supplier infrastructure which can serve the needs of both military and commercial customers. The model for the ASEM concept is the merchant ASIC business. Goals for turn-around time, cost, and quality would be similar to what ASIC vendors offer today. Enabling technologies being developed include: (1) new software tools for design, manufacture, and test; (2) flexible manufacturing equipment and processes; and (3) brokering systems and technology to facilitate electronic interchange of ASEM product specifications and design data. These technologies will be integrated at several prototypical ASEM foundries to provide cost-effective, low volume, quick turn-around access as well as high-volume production capability.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302154\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302154","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Summary form only given. Despite demand for higher performance, miniaturization, and more cost-effective subsystem packaging, potential users of MCM technology have been frustrated by long lead times, high costs, and perceived risks of depending upon an unproven supplier infrastructure. In order to address these issues, the application specific electronic module (ASEM) program has been established. The goal of that effect is to help create a viable domestic supplier infrastructure which can serve the needs of both military and commercial customers. The model for the ASEM concept is the merchant ASIC business. Goals for turn-around time, cost, and quality would be similar to what ASIC vendors offer today. Enabling technologies being developed include: (1) new software tools for design, manufacture, and test; (2) flexible manufacturing equipment and processes; and (3) brokering systems and technology to facilitate electronic interchange of ASEM product specifications and design data. These technologies will be integrated at several prototypical ASEM foundries to provide cost-effective, low volume, quick turn-around access as well as high-volume production capability.<>