一种快速灵活的热模拟工具，在智能电源设备上进行了验证

Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005. Pub Date : 2005-05-23 DOI:10.1109/ISPSD.2005.1487963

B. Desoete, P. Moens, R. Gillon, E. Driessens, B. Elattari, G. V. D. Bosch, Guido Groeseneken

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引用次数: 4

摘要

在本文中，我们提出了一个基于解析方程的热模拟工具，它能够计算任意数量的任意电源下模具上的温度分布作为时间的函数。该工具比专用的数值软件快得多，并为电路设计人员提供了很大的灵活性。计算结果与商业软件计算结果吻合较好。此外，为了验证温度预测，还进行了脉冲DMOS测量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A fast and flexible thermal simulation tool validated on smart power devices

In this paper we present a thermal simulation tool based on analytical equations, which is able to calculate temperature distributions on a die as a function of time for any number of arbitrary power sources. The tool is much faster than dedicated numerical software and offers a large flexibility to circuit designers. The results have been found to agree well with results from commercial software. Moreover, pulsed DMOS measurements have been performed in order to validate the temperature predictions.

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Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.

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