1.03pW/b超低漏压堆叠SRAM智能边缘处理器

Jingcheng Wang, Hyochan An, Qirui Zhang, Hun-Seok Kim, D. Blaauw, D. Sylvester
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引用次数: 6

摘要

提出了一种堆叠电压域SRAM,其中阵列分为两组(顶部和底部),其电源串联连接。系统供电电流由顶部和底部阵列重复使用,供电电压在两组阵列之间分配,从而在具有标称电源的大型系统中实现超低电压SRAM的无缝集成,而不需要降低效率的LDO。阵列交换方法在一个系统时钟周期内提供对任意银行的稳定访问。采用综合尺寸策略(W&L)来最佳地平衡保持稳定性和位元大小。集成在40nm CMOS的物联网成像系统中,所提出的8.9Mb SRAM实现1.03pW/bit的泄漏,比相同技术的传统SRAM降低了100倍以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
1.03pW/b Ultra-Low Leakage Voltage-Stacked SRAM for Intelligent Edge Processors
A stacked voltage domain SRAM is proposed where arrays are split into two sets (top and bottom) with their supplies connected in series. System supply current is reused by top and bottom sets, and supply voltage is divided among the two sets of arrays, enabling seamless integration of very low voltage SRAM retention in a larger system with a nominal supply, without need for an efficiency-reducing LDO. An array swapping approach provides stable access to arbitrary banks within one system clock cycle. A comprehensive sizing strategy (W&L) is employed to optimally balance hold stability and bitcell size. Integrated in an IoT imaging system in 40nm CMOS, the proposed 8.9Mb SRAM achieves 1.03pW/bit leakage, a >100× reduction over conventional SRAM in the same technology.
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