从预硅到后硅的自动调试

M. Dehbashi, G. Fey
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引用次数: 10

摘要

由于现代集成电路(IC)的设计尺寸和复杂性不断增加,以及上市时间的缩短,调试成为集成电路开发周期中的主要瓶颈之一。本文提出了一种通用的自动化调试方法,可用于从设计调试到硅后调试的不同场景。该方法基于基于模型的诊断。诊断跟踪是一种改进,减少了调试时间,提高了诊断准确性。实验结果表明了该方法在后期调试中的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Automated debugging from pre-silicon to post-silicon
Due to the increasing design size and complexity of modern Integrated Circuits (IC) and the decreasing time-to-market, debugging is one of the major bottlenecks in the IC development cycle. This paper presents a generalized approach to automate debugging which can be used in different scenarios from design debugging to post-silicon debugging. The approach is based on model-based diagnosis. Diagnostic traces are proposed as an enhancement reducing debugging time and increasing diagnosis accuracy. The experimental results show the effectiveness of the approach in post-silicon debugging.
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