局限外延横向过度生长(CELO):在大面积Si衬底上可扩展集成cmos兼容InGaAs-on-insulator mosfet的新概念

L. Czornomaz, E. Uccelli, M. Sousa, V. Deshpande, V. Djara, D. Caimi, M. Rossell, R. Erni, J. Fompeyrine
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引用次数: 76

摘要

我们报道了首次在硅衬底上实现高质量InGaAs绝缘体(InGaAs- oi)的cmos兼容集成的新概念,即局限外延横向过度生长(CELO)。这种基于选择性外延的方法只需要使用标准的大面积硅衬底和典型的CMOS工艺。它可以从大块和SOI Si晶圆开始制造InGaAs-OI。InGaAs外延结构具有非常低的缺陷,可以满足超薄体和基于翅片的先进CMOS节点的要求。展示了栅极优先自对准finfet(100纳米长栅极,50纳米宽鳍片和250纳米宽插件触点)具有与最先进的InGaAs mosfet相匹配的优异电气特性,突出表明这一新概念具有巨大的潜力,可以在先进CMOS节点的大批量制造中引入高迁移率通道材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Confined Epitaxial Lateral Overgrowth (CELO): A novel concept for scalable integration of CMOS-compatible InGaAs-on-insulator MOSFETs on large-area Si substrates
We report on the first demonstration of the CMOS-compatible integration of high-quality InGaAs on insulator (InGaAs-OI) on Si substrates by a novel concept named Confined Epitaxial Lateral Overgrowth (CELO). This method, based on selective epitaxy, only requires the use of standard large-area silicon substrates and typical CMOS processes. It enables the fabrication of InGaAs-OI starting from both bulk and SOI Si wafers. The InGaAs epitaxial structures are characterized by a very low defectivity, and can fulfill the requirements of both ultra-thin-body and fins-based advanced CMOS nodes. Gate-first self-aligned FinFETs (100-nm-long gate, 50-nm-wide fins and 250-nm-wide plug-contacts) with excellent electrical characteristics comparable to start-of-the-art InGaAs MOSFETs on Si are demonstrated, highlighting that this new concept has significant potential to enable introduction of high-mobility channel materials in high-volume manufacturing of advanced CMOS nodes.
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