隧道氧化物中边缘FN应力引起的泄漏电流

N. Zous, C. Yeh, C.W. Tsai, L. Chiang, Tahui Wang
{"title":"隧道氧化物中边缘FN应力引起的泄漏电流","authors":"N. Zous, C. Yeh, C.W. Tsai, L. Chiang, Tahui Wang","doi":"10.1109/VTSA.1999.786050","DOIUrl":null,"url":null,"abstract":"The mechanism and characteristics of edge FN stress induced leakage current (SILC) in tunnel oxides are investigated. The dominant SILC mechanism is found to be positive oxide charge assisted electron tunneling. A pronounced transient effect in edge FN SILC is observed. The transient effect arises from the fact that positive oxide charges, which help electrons tunnel through the oxide, can themselves escape to the Si substrate at a positive measurement field. The edge FN SILC can be significantly reduced by using a substrate hot electron injection technique.","PeriodicalId":237214,"journal":{"name":"1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Edge FN stress induced leakage current in tunnel oxides\",\"authors\":\"N. Zous, C. Yeh, C.W. Tsai, L. Chiang, Tahui Wang\",\"doi\":\"10.1109/VTSA.1999.786050\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The mechanism and characteristics of edge FN stress induced leakage current (SILC) in tunnel oxides are investigated. The dominant SILC mechanism is found to be positive oxide charge assisted electron tunneling. A pronounced transient effect in edge FN SILC is observed. The transient effect arises from the fact that positive oxide charges, which help electrons tunnel through the oxide, can themselves escape to the Si substrate at a positive measurement field. The edge FN SILC can be significantly reduced by using a substrate hot electron injection technique.\",\"PeriodicalId\":237214,\"journal\":{\"name\":\"1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTSA.1999.786050\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTSA.1999.786050","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

研究了隧道氧化物中边缘FN应力诱发漏电流的机理和特性。研究发现,主要的SILC机制是氧化正电荷辅助电子隧穿。在边缘FN SILC中观察到明显的瞬态效应。瞬态效应源于这样一个事实,即帮助电子隧穿氧化物的正氧化物电荷可以在正测量场中逃逸到Si衬底。利用衬底热电子注入技术,可以显著降低边缘FN硅碳密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Edge FN stress induced leakage current in tunnel oxides
The mechanism and characteristics of edge FN stress induced leakage current (SILC) in tunnel oxides are investigated. The dominant SILC mechanism is found to be positive oxide charge assisted electron tunneling. A pronounced transient effect in edge FN SILC is observed. The transient effect arises from the fact that positive oxide charges, which help electrons tunnel through the oxide, can themselves escape to the Si substrate at a positive measurement field. The edge FN SILC can be significantly reduced by using a substrate hot electron injection technique.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信