半导体元件故障评估及应用层面的概率影响评估

Jonas Stricker, C. Kain, Jérôme Kirscher, Andi Buzo, L. Maurer, G. Pelz
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引用次数: 0

摘要

组件级别的故障会以多种不同的方式影响应用程序的行为。在产品开发过程中,了解这种影响的严重程度和可能性是至关重要的。目前处理此类问题的方法是基于工程判断的,但是这些方法受到应用程序及其组件的复杂性的限制。在本文中,我们提出了一种自动化的方法,我们在组件级别对故障进行建模,通过仿真在应用中传播它们,对故障进行聚类,并估计不同应用故障模式的总体概率。该方法应用于汽车电动助力转向应用,而感兴趣的组件是模数转换器和电流传感器。结果表明,元器件层面的大量失效模式归结为应用层面的极少失效模式。对于这些失效模式中的每一种,发生的概率都是从部件级别1的相关根本原因开始计算的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Semiconductor Component Fault Assessment and Probability Impact Estimation on Application Level
Failures at component level can affect the application behavior in many different ways. During product development it is crucial to know the severity and the probability of such influence. The current methodologies for dealing with such problems are based on engineering judgment, but these are limited by the complexity of the applications and its components. In this paper, we present an automated approach in which we model the failures at component level, propagate them in application through simulation, cluster the failures and estimate the overall probability that different application failure modes have. This approach is applied on an automotive Electric Power Steering application while the components of interest are an analog-to-digital converter and a current sensor. The results show that the large number of failure modes on component level boils down to a very low number of application failure modes. For each of these failure modes the probability of occurrence is computed starting from the related root causes on component level1.
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