{"title":"用于通信和传感的3D/喷墨打印毫米波组件和互连","authors":"A. Georgiadis, J. Kimionis, M. Tentzeris","doi":"10.1109/CSICS.2017.8240447","DOIUrl":null,"url":null,"abstract":"This paper presents the design and experimental results of 3D/inkjet printed circuits operating in millimeter wave frequencies. Millimeter wave technology is particularly suitable for 5G communication systems however it is also associated with a higher cost, and larger time-to-market. 3D/inkjet printing technology presents an exciting alternative to traditional fabrication techniques being cost-efficient, and allowing for rapid prototyping. This paper offers an overview of recent results associated with fully printed planar antennas, lens antennas, millimeter wave interconnects and sensors demonstrating the potential of the technology.","PeriodicalId":129729,"journal":{"name":"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"3D/Inkjet-printed millimeter wave components and interconnects for communication and sensing\",\"authors\":\"A. Georgiadis, J. Kimionis, M. Tentzeris\",\"doi\":\"10.1109/CSICS.2017.8240447\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the design and experimental results of 3D/inkjet printed circuits operating in millimeter wave frequencies. Millimeter wave technology is particularly suitable for 5G communication systems however it is also associated with a higher cost, and larger time-to-market. 3D/inkjet printing technology presents an exciting alternative to traditional fabrication techniques being cost-efficient, and allowing for rapid prototyping. This paper offers an overview of recent results associated with fully printed planar antennas, lens antennas, millimeter wave interconnects and sensors demonstrating the potential of the technology.\",\"PeriodicalId\":129729,\"journal\":{\"name\":\"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2017.8240447\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2017.8240447","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D/Inkjet-printed millimeter wave components and interconnects for communication and sensing
This paper presents the design and experimental results of 3D/inkjet printed circuits operating in millimeter wave frequencies. Millimeter wave technology is particularly suitable for 5G communication systems however it is also associated with a higher cost, and larger time-to-market. 3D/inkjet printing technology presents an exciting alternative to traditional fabrication techniques being cost-efficient, and allowing for rapid prototyping. This paper offers an overview of recent results associated with fully printed planar antennas, lens antennas, millimeter wave interconnects and sensors demonstrating the potential of the technology.
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