HK PMOS TDDB的非威布尔分布研究

Jeong-hwan Hwang, Yong Gon Lee, Sang Ho Lee, Sung Kye Park
{"title":"HK PMOS TDDB的非威布尔分布研究","authors":"Jeong-hwan Hwang, Yong Gon Lee, Sang Ho Lee, Sung Kye Park","doi":"10.1109/EDTM55494.2023.10102956","DOIUrl":null,"url":null,"abstract":"In DRAM manufacturing, HK dielectric stacks with HfO2/HfSiOx are being used as a replacement for conventional silicon oxide dielectrics for high speed. One of the major problems is reliability of gate dielectric. Especially, non-Weibull distribution in PMOS TDDB has been observed. This abnormal behavior has been attributed to the effect of HKMG bi-layer structure and the Tinv variation. Finally, we suggest precise method for lifetime extraction in this abnormal case.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"122 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Study of the non-Weibull distribution of HK PMOS TDDB\",\"authors\":\"Jeong-hwan Hwang, Yong Gon Lee, Sang Ho Lee, Sung Kye Park\",\"doi\":\"10.1109/EDTM55494.2023.10102956\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In DRAM manufacturing, HK dielectric stacks with HfO2/HfSiOx are being used as a replacement for conventional silicon oxide dielectrics for high speed. One of the major problems is reliability of gate dielectric. Especially, non-Weibull distribution in PMOS TDDB has been observed. This abnormal behavior has been attributed to the effect of HKMG bi-layer structure and the Tinv variation. Finally, we suggest precise method for lifetime extraction in this abnormal case.\",\"PeriodicalId\":418413,\"journal\":{\"name\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"volume\":\"122 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTM55494.2023.10102956\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10102956","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在DRAM制造中,HfO2/HfSiOx的HK介电堆被用作传统氧化硅介电体的高速替代品。栅极电介质的可靠性是主要问题之一。特别是在PMOS TDDB中观察到非威布尔分布。这种异常行为归因于HKMG双层结构和Tinv变化的影响。最后,我们对这种异常病例提出了精确的终生提取方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Study of the non-Weibull distribution of HK PMOS TDDB
In DRAM manufacturing, HK dielectric stacks with HfO2/HfSiOx are being used as a replacement for conventional silicon oxide dielectrics for high speed. One of the major problems is reliability of gate dielectric. Especially, non-Weibull distribution in PMOS TDDB has been observed. This abnormal behavior has been attributed to the effect of HKMG bi-layer structure and the Tinv variation. Finally, we suggest precise method for lifetime extraction in this abnormal case.
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