{"title":"基于优化的led热瞬态测量网络辨识","authors":"Nils J. Ziegeler, P. Nolte, S. Schweizer","doi":"10.1109/THERMINIC52472.2021.9626491","DOIUrl":null,"url":null,"abstract":"In transient thermal testing, network identification by deconvolution is a frequently used technique to analyze the thermal properties of a device. To obtain reliable results, the method requires measurement data with a high signal-to-noise ratio. In particular, the derivation and deconvolution steps yield inaccurate results when confronted with noisy data. In this work, an alternative evaluation procedure called optimization-based network identification is applied to thermal transient data. The method uses a multidimensional optimization to generate a piecewise uniform structure function, which has a thermal impedance that matches the measurement data well. To judge the accuracy of the optimization-based network identification and to compare it to other methods objectively, accuracy measures are developed. Several variants of network identification a re tested using a reference structure in dependence of the signal-to-noise ratio. Finally, the optimization-based network identification is applied to transient thermal measurements conducted on LEDs. In addition, a transient dual interface test is evaluated comparing the classical approach to the optimization-based network identification.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimization-based Network Identification for Thermal Transient Measurements on LEDs\",\"authors\":\"Nils J. Ziegeler, P. Nolte, S. Schweizer\",\"doi\":\"10.1109/THERMINIC52472.2021.9626491\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In transient thermal testing, network identification by deconvolution is a frequently used technique to analyze the thermal properties of a device. To obtain reliable results, the method requires measurement data with a high signal-to-noise ratio. In particular, the derivation and deconvolution steps yield inaccurate results when confronted with noisy data. In this work, an alternative evaluation procedure called optimization-based network identification is applied to thermal transient data. The method uses a multidimensional optimization to generate a piecewise uniform structure function, which has a thermal impedance that matches the measurement data well. To judge the accuracy of the optimization-based network identification and to compare it to other methods objectively, accuracy measures are developed. Several variants of network identification a re tested using a reference structure in dependence of the signal-to-noise ratio. Finally, the optimization-based network identification is applied to transient thermal measurements conducted on LEDs. In addition, a transient dual interface test is evaluated comparing the classical approach to the optimization-based network identification.\",\"PeriodicalId\":302492,\"journal\":{\"name\":\"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC52472.2021.9626491\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC52472.2021.9626491","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optimization-based Network Identification for Thermal Transient Measurements on LEDs
In transient thermal testing, network identification by deconvolution is a frequently used technique to analyze the thermal properties of a device. To obtain reliable results, the method requires measurement data with a high signal-to-noise ratio. In particular, the derivation and deconvolution steps yield inaccurate results when confronted with noisy data. In this work, an alternative evaluation procedure called optimization-based network identification is applied to thermal transient data. The method uses a multidimensional optimization to generate a piecewise uniform structure function, which has a thermal impedance that matches the measurement data well. To judge the accuracy of the optimization-based network identification and to compare it to other methods objectively, accuracy measures are developed. Several variants of network identification a re tested using a reference structure in dependence of the signal-to-noise ratio. Finally, the optimization-based network identification is applied to transient thermal measurements conducted on LEDs. In addition, a transient dual interface test is evaluated comparing the classical approach to the optimization-based network identification.