11.5pW/bit 400mV 5T增益单元eDRAM,用于28nm FD-SOI的ULP应用

R. Giterman, A. Teman, A. Fish
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引用次数: 2

摘要

超低功耗(ULP)应用的硅领域通常由嵌入式存储器主导,嵌入式存储器是这些应用中静态和动态功耗的主要消费者[1]。电源电压降至亚阈值区域被广泛用于显著降低ULP应用的静态和动态功耗[2]。然而,嵌入式存储器(通常由SRAM实现)一直是积极电压缩放的限制因素,因为传统的6晶体管(6T) SRAM位单元在接近阈值的工作电压时会变得不可靠[3-6]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 11.5pW/bit 400mV 5T gain-cell eDRAM for ULP applications in 28nm FD-SOI
The silicon area of ultra-low power (ULP) applications is often dominated by embedded memories, which are the main consumers of both the static and dynamic power in these applications [1]. Supply voltage scaling down to the sub-threshold region is widely used to significantly reduce both the static and dynamic power dissipation of ULP applications [2]. However, embedded memories, typically implemented with SRAM, have been the limiting factor for aggressive voltage scaling, since the conventional 6-transistor (6T) SRAM bitcell becomes unreliable at near-threshold operating voltages [3-6].
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